TECHNICAL GUIDE

Heat-sealing temperatures for PP and COC microplates

Use the catalog starting settings, then establish a sealing window for your plate and sealer.

Why plate material changes sealing conditions

PP and COC microplates differ in material and rim geometry. One film can behave differently on each plate. Adjust temperature, dwell time and pressure for the actual plate while checking seal continuity and plate distortion.

Start with the catalog settings

The LuxLok catalog recommends 150–180°C for 3–5 seconds for LX11031R, a 100 μm aluminum roll film. Listed plate materials include PP, COC, PE, PS and PC. Start within this range for each plate material and confirm the final settings on the actual plate.

Plate materialCatalog starting rangeWhat to inspect
PPLX11031R: 150–180°C, 3–5 secondsRim distortion, seal continuity and peel behavior
COCLX11031R: 150–180°C, 3–5 secondsEdge sealing, evaporation and peel behavior

Find a suitable temperature and dwell time

  1. Record plate material, well count, plate format, sealer model and film code.
  2. Choose a point within the suggested range. Keep pressure and dwell time constant while adjusting temperature in steps.
  3. Inspect every well rim for lifted edges, punctures and plate distortion.
  4. Recheck promising settings with peeling, evaporation and actual storage conditions, then document the final settings.

Common problems

  • Incomplete or lifted seal: inspect rim flatness and heat-plate contact before adjusting settings within the suggested range.
  • Distorted rim or difficult peeling: reduce heat input and review temperature and dwell time.
  • One area seals poorly: inspect heat-plate flatness, plate loading and pressure distribution.

For PlateLoc-style equipment, continue with the switching checklist and the LX11031R product specifications.

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